S9S12XS256J0CAL Freescale Semiconductor, S9S12XS256J0CAL Datasheet - Page 669

• Manufacturer Part Number: S9S12XS256J0CAL
• Description: MCU 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of S9S12XS256J0CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 8K x 8
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: S12XS
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 12 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: DEMO9S12XSFAME, EVB9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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2
3
A.1.10
This section describes the current consumption characteristics of the device as well as the conditions for
the measurements.
A.1.10.1
Since the current consumption of the output drivers is load dependent, all measurements are without output
loads and with minimum I/O activity. The currents are measured in single chip mode, S12XCPU code is
executed from Flash. V
using a 4MHz oscillator in loop controlled Pierce mode.
Since the DBG and BDM modules are typically not used in the end application, the supply current values
for these modules is not specified.
An overhead of current consumption exists independent of the listed modules, due to voltage regulation
and clock logic that is not dedicated to a specific module. This is listed in the table row named “overhead”.
Table A-9
A.1.10.2
Currents are measured in single chip mode, S12XCPU with V
enabled and a 40MHz bus frequency from a 4MHz input. Characterized parameters are derived using a
Freescale Semiconductor
Conditions are 4.5 V < V
I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins.
16
17
18
Maximum leakage current occurs at maximum operating temperature.
Refer to
Parameter only applies in stop or pseudo stop mode.
Peripheral
D Port H, J, P interrupt input pulse passed (STOP)
D IRQ pulse width, edge-sensitive mode (STOP)
D XIRQ pulse width with X-bit set (STOP)
Table A-9. Module Configurations for Typical Run Supply (VDDR+VDDA) Current
S12XCPU
Overhead
MSCAN
PWM
Section A.1.4, “Current Injection”
ATD
SPI
SCI
TIM
shows the configuration of the peripherals for typical run current.
Supply Currents
Typical Run Current Measurement Conditions
Maximum Run Current Measurement Conditions
DD35
420 cycle loop: 384 DBNE cycles plus subroutine entry to stimulate stacking (RAM access)
Configured to loop-back mode using a bit rate of 500kbit/s
Configured to master mode, continuously transmit data (0x55 or 0xAA) at 2Mbit/s
Configured into loop mode, continuously transmit data (0x55) at speed of 19200 baud
Configured to toggle its pins at the rate of 1kHz
The peripheral shall be configured in output compare mode. Pulse accumulator and modulus
counter enabled.
The peripheral is configured to operate at its maximum specified
frequency and to continuously convert voltages on all input channels in sequence.
VREG supplying 1.8V from a 5V input voltage, PLL on
DD35
< 5.5 V junction temperature from –40°C to +150°C, unless otherwise noted
=5V, internal voltage regulator is enabled and the bus frequency is 40MHz
S12XS Family Reference Manual, Rev. 1.11
Table A-8. 5-V I/O Characteristics
for more details
PW
Configuration
PW
t
PULSE
XIRQ
IRQ
DD35
=5.5V, internal voltage regulator
4
1
4
—
—
—
Electrical Characteristics
V
DD35
—
—
—
=5V
tcyc
tcyc
tosc
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