DF61657CN35FTV Renesas Electronics America, DF61657CN35FTV Datasheet - Page 286

IC H8SX/1657 MCU FLASH 120TQFP

DF61657CN35FTV

Manufacturer Part Number
DF61657CN35FTV
Description
IC H8SX/1657 MCU FLASH 120TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of DF61657CN35FTV

Core Processor
H8SX
Core Size
32-Bit
Speed
35MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
82
Program Memory Size
768KB (768K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
For Use With
3DK1657 - DEV EVAL KIT FOR H8SX/1657
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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Quantity:
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Section 7 DMA Controller (DMAC)
(2)
In single address mode, data between an external device and an external memory is directly
transferred using the DACK pin instead of DSAR or DDAR. A transfer at a time is performed in
one bus cycle. In this mode, the data bus width must be the same as the data access size. For
details on the data bus width, see section 6, Bus Controller (BSC).
The DMAC accesses an external device as the transfer source or destination by outputting the
strobe signal (DACK) to the external device with DACK and accesses the other transfer target by
outputting the address. Accordingly, the DMA transfer is performed in one bus cycle. Figure 7.4
shows an example of a transfer between an external memory and an external device with the
DACK pin. In this example, the external device outputs data on the data bus and the data is written
to the external memory in the same bus cycle.
The transfer direction is decided by the DIRS bit in DACR which specifies an external device with
the DACK pin as the transfer source or destination. When DIRS = 0, data is transferred from an
external memory (DSAR) to an external device with the DACK pin. When DIRS = 1, data is
transferred from an external device with the DACK pin to an external memory (DDAR). The
settings of registers which are not used as the transfer source or destination are ignored.
The DACK signal output is enabled in single address mode by the DACKE bit in DMDR. The
DACK signal is low active.
The TEND signal output is enabled or disabled by the TENDE bit in DMDR. The TEND signal is
output in one bus cycle. When an idle cycle is inserted before the bus cycle, the TEND signal is
also output in the idle cycle.
Figure 7.5 shows an example of timing charts in single address mode and figure 7.6 shows an
example of operation in single address mode.
Rev. 2.00 Jun. 28, 2007 Page 260 of 864
REJ09B0341-0200
Single Address Mode
Address B
Address T
A
A
Figure 7.3 Operations in Dual Address Mode
Transfer
Address update setting is as follows:
Source address increment
Fixed destination address
Address T
B

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