HD6417705F133BV Renesas Electronics America, HD6417705F133BV Datasheet - Page 308

MPU 3V 0K PB-FREE 208 FP

HD6417705F133BV

Manufacturer Part Number
HD6417705F133BV
Description
MPU 3V 0K PB-FREE 208 FP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of HD6417705F133BV

Core Processor
SH-3
Core Size
32-Bit
Speed
133MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
105
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
8.4.4
DMA transfer has two types; single address mode transfer and dual address mode transfer. They
depend on the number of bus cycles of access to source and destination. A data transfer timing
depends on the bus mode, which has cycle steal mode and burst mode. The DMAC supports the
transfers shown in table 8.8.
Table 8.8
Source
External device with DACK
External memory
Memory-mapped external
device
On-chip peripheral module
Notes: 1. Dual: Dual address mode
Rev. 2.00, 09/03, page 260 of 690
2. Single: Single address mode
3. A 16-byte transfer is available only for the registers to which longword-size access is
DMA Transfer Types
enabled in the on-chip peripheral modules.
Supported DMA Transfers
External
Device with
DACK
Not available Dual, single Dual, single
Dual, single
Dual, single
Not
available
External
Memory
Dual
Dual
Dual
Destination
Memory-
Mapped
External Device
Dual
Dual
Dual
On-Chip Peripheral
Module
Not available
Dual
Dual
Dual

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