HD6417727F160V Renesas Electronics America, HD6417727F160V Datasheet - Page 391

MPU 3V 16K PB-FREE 240-QFP

HD6417727F160V

Manufacturer Part Number
HD6417727F160V
Description
MPU 3V 16K PB-FREE 240-QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of HD6417727F160V

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
160MHz
Connectivity
FIFO, SCI, SIO, SmartCard, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
104
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.7 V ~ 2.05 V
Data Converters
A/D 6x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
240-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

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Address Multiplexing: Synchronous DRAM can be connected without external multiplexing
circuitry in accordance with the address multiplex specification bits AMX3 to AMX0 in MCR.
Table 12.12 shows the relationship between the address multiplex specification bits and the bits
output at the address pins. Table 12.13 shows the relationship between LSI address pins and
synchronous DRAM address pins.
A25 to A17 and A0 are not multiplexed; the original values are always output at these pins.
When A0, the LSB of the synchronous DRAM address, is connected to this LSI, it performs
longword address specification. Connection should therefore be made in the following order: with
a 32-bit bus width, connect pin A0 of the synchronous DRAM to pin A2 of this LSI, then connect
pin A1 to pin A3; with a 16-bit bus width, connect pin A0 of the synchronous DRAM to pin A1 of
this LSI, then connect pin A1 and pin A2.
Figure 12.12 Example of 64-Mbit Synchronous DRAM (16-Bit Bus Width)
SH7727
CKIO, CKIO2
DQMLU
DQMLL
RD/WR
CKE
RAS
CAS
CSn
D15
A14
A13
A12
D0
A1
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Rev.6.00 Mar. 27, 2009 Page 333 of 1036
Section 12 Bus State Controller (BSC)
64M synchronous DRAM
(1M × 16-bit × 4-bank)
·
·
·
·
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A13
A12
A11
A0
CLK
CKE
CS
RAS
CAS
WE
DQ15
DQ0
DQMU
DQML
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REJ09B0254-0600

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