HD6417727F160V Renesas Electronics America, HD6417727F160V Datasheet - Page 421

MPU 3V 16K PB-FREE 240-QFP

HD6417727F160V

Manufacturer Part Number
HD6417727F160V
Description
MPU 3V 16K PB-FREE 240-QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of HD6417727F160V

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
160MHz
Connectivity
FIFO, SCI, SIO, SmartCard, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
104
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.7 V ~ 2.05 V
Data Converters
A/D 6x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
240-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

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12.3.8
When a bus release request (BREQ) is received from an external device, buses are released after
the bus cycle being executed is completed and a bus grant signal (BACK) is output. The bus is not
released during burst transfers for cache fills or TAS instruction execution between the read cycle
and write cycle. Bus arbitration is not executed in multiple bus cycles that are generated when the
data bus width is shorter than the access size; i.e. in the bus cycles when longword access is
executed for the 8-bit memory. At the negation of BREQ, BACK is negated and bus use is
restarted. See Appendix A.1, Pin Functions, for the pin state when the bus is released.
CKIO
A25 to A0
CSm
CSn
BS
RD/WR
RD
D31 to D0
Bus Arbitration
Area m inter-access wait specification
Area m read
T1
Figure 12.33 Waits between Access Cycles
T2
Twait
Area n space read
T1
Area n inter-access wait specification
T2
Rev.6.00 Mar. 27, 2009 Page 363 of 1036
Section 12 Bus State Controller (BSC)
Twait
Area n space write
T1
REJ09B0254-0600
T2

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