HD6417706F133 Renesas Electronics America, HD6417706F133 Datasheet - Page 322
HD6417706F133
Manufacturer Part Number
HD6417706F133
Description
IC SUPERH MPU ROMLESS 176LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.HD6417706F133V.pdf
(751 pages)
Specifications of HD6417706F133
Core Processor
SH-3
Core Size
32-Bit
Speed
133MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.75 V ~ 2.05 V
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
176-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
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Quantity:
20 000
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Part Number:
HD6417706F133V
Manufacturer:
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Manufacturer:
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Section 9 Direct Memory Access Controller (DMAC)
9.4.4
The DMAC supports the transfers shown in table 9.4. The dual address mode has the direct
address mode and the indirect address mode. In the direct address mode, an output address value is
the data transfer target address; in the indirect address mode, the value stored in the output
address, not the output address value itself, is the data transfer target address. A data transfer
timing depends on the bus mode, which has cycle steal mode and burst mode.
Table 9.4
Notes: 1. Dual: Dual address mode
Rev. 5.00 May 29, 2006 page 272 of 698
REJ09B0146-0500
Source
External device with
DACK
External memory
Memory-mapped
external device
On-chip peripheral
module
2. Single: Single address mode
3. The dual address mode includes the direct address mode and the indirect address
4. 16-byte transfer is not available for on-chip peripheral modules.
DMA Transfer Types
mode.
Supported DMA Transfers
External Device
with DACK
Not available
Dual, single
Dual, single
Not available
External
Memory
Dual, single
Dual
Dual
Dual
Destination
Memory-
Mapped External
Device
Dual, single
Dual
Dual
Dual
On-Chip
Peripheral
Module
Not available
Dual
Dual
Dual
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