MC9S12XDP512MAG Freescale, MC9S12XDP512MAG Datasheet - Page 682

MC9S12XDP512MAG

Manufacturer Part Number
MC9S12XDP512MAG
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S12XDP512MAG

Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C/SCI/SPI
Total Internal Ram Size
32KB
# I/os (max)
119
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/3.15V
On-chip Adc
2(24-chx10-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
512KB
Lead Free Status / RoHS Status
Compliant

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Chapter 18 Memory Mapping Control (S12XMMCV3)
18.4.4
The MMC controls the address buses and the data buses that interface the S12X masters (CPU, BDMand
XGATE) with the rest of the system (master buses). In addition the MMC handles all CPU read data bus
swapping operations. All internal and external resources are connected to specific target buses (see
Figure 18-26
1. Doted blocks and lines are optional. Please refer to the Device User Guide for their availlibilities.
682
EBI
XGATE
Chip Bus Control
XBUS3
1
).
XGATE
XBUS1
FLASH
DBG
FTX
Figure 18-26. MMC Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.21
MMC “Crossbar Switch”
EETX
XBUS0
CPU
S12X0
resources
BDM
BDM
S12X1
XSRAM
XRAM
Freescale Semiconductor
FLEXRAY
IPBI
S12X2
XBUS2

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