MC9S12XDP512MAG Freescale, MC9S12XDP512MAG Datasheet - Page 756

MC9S12XDP512MAG

Manufacturer Part Number
MC9S12XDP512MAG
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S12XDP512MAG

Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C/SCI/SPI
Total Internal Ram Size
32KB
# I/os (max)
119
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/3.15V
On-chip Adc
2(24-chx10-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
512KB
Lead Free Status / RoHS Status
Compliant

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Chapter 20 S12X Debug (S12XDBGV3) Module
20.3.2.7
There is a dedicated control register for each of the state sequencer states 1 to 3 that determines if
transitions from that state are allowed, depending upon comparator matches or tag hits, and defines the
next state for the state sequencer following a match. The three debug state control registers are located at
the same address in the register address map (0x0027). Each register can be accessed using the COMRV
bits in DBGC1 to blend in the required register. The COMRV = 11 value blends in the match flag register
(DBGMFR).
758
Debug State Control Registers
Table 20-19. State Control Register Access Encoding
COMRV
00
01
10
11
MC9S12XDP512 Data Sheet, Rev. 2.21
Visible State Control Register
DBGSCR1
DBGSCR2
DBGSCR3
DBGMFR
Freescale Semiconductor

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