mfr4200 Freescale Semiconductor, Inc, mfr4200 Datasheet - Page 225

• Manufacturer Part Number: mfr4200
• Description: Flexray Communication Controllers
• Manufacturer: Freescale Semiconductor, Inc

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Freescale Semiconductor
Num
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and EIA/JEDEC Standard 51-2 with the single layer horizontal PC Board according to EIA/JEDEC Standard
51-3
Per EIA/JEDEC Standard 51-6 with the four layer horizontal PC Board (double-sided PCB with two internal planes) according
to EIA/JEDEC Standard 51-7
Thermal resistance between the die and the printed circuit board per EIA/JEDEC Standard 51-8. Board temperature is
measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per EIA/JEDEC Standard 51-2.
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Junction to Ambient LQFP64, single sided PCB
Junction to Ambient LQFP64, double sided PCB with 2 internal planes
Convection
Junction to Ambient LQFP64 (@200 ft/min), single sided PCB
Junction to Ambient LQFP64 (@200 ft/min), double sided PCB with 2 internal
planes
Junction to Board LQFP64
Junction to Case LQFP64
Junction to Package Top LQFP64
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Table A-5. Thermal Package Simulation Details
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, Natural Convection
Rating
MFR4200 Data Sheet, Rev. 0
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, Natural Convection
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1,3
, Natural
Symbol
R
R
R
RTJA
R
R
<
TJMA
TJMA
TJMA
TJC
TJB
JT
Value
67
52
60
48
34
17
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General
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o
o
o
o
o
o
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
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