LPC1343FHN33,551 NXP Semiconductors, LPC1343FHN33,551 Datasheet - Page 244
LPC1343FHN33,551
Manufacturer Part Number
LPC1343FHN33,551
Description
IC MCU 32BIT 32KB FLASH 33HVQFN
Manufacturer
NXP Semiconductors
Series
LPC13xxr
Specifications of LPC1343FHN33,551
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC13
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, UART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
28
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, KSK-LPC1343
Development Tools By Supplier
OM11039, OM11040, OM11046, OM11048
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Package
33HVQFN EP
Device Core
ARM Cortex M3
Family Name
LPC1000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4944
935289655551
935289655551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1343FHN33,551
Manufacturer:
NXP
Quantity:
780
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NXP Semiconductors
UM10375
User manual
Fig 40. SPI frame format with CPOL = 1 and CPHA = 0 (a) Single and b) Continuous Transfer)
a. Single transfer with CPOL=1 and CPHA=0
b. Continuous transfer with CPOL=1 and CPHA=0
SSEL
MOSI
MISO
SCK
MSB
MSB
In this configuration, during idle periods:
If the SSP is enabled and there is valid data within the transmit FIFO, the start of
transmission is signified by the SSEL master signal being driven LOW, which causes
slave data to be immediately transferred onto the MISO line of the master. Master’s MOSI
pin is enabled.
One half period later, valid master data is transferred to the MOSI line. Now that both the
master and slave data have been set, the SCK master clock pin becomes LOW after one
further half SCK period. This means that data is captured on the falling edges and be
propagated on the rising edges of the SCK signal.
In the case of a single word transmission, after all bits of the data word are transferred, the
SSEL line is returned to its idle HIGH state one SCK period after the last bit has been
captured.
However, in the case of continuous back-to-back transmissions, the SSEL signal must be
pulsed HIGH between each data word transfer. This is because the slave select pin
freezes the data in its serial peripheral register and does not allow it to be altered if the
CPHA bit is logic zero. Therefore the master device must raise the SSEL pin of the slave
device between each data transfer to enable the serial peripheral data write. On
completion of the continuous transfer, the SSEL pin is returned to its idle state one SCK
period after the last bit has been captured.
•
•
•
The CLK signal is forced HIGH.
SSEL is forced HIGH.
The transmit MOSI/MISO pad is in high impedance.
SSEL
MOSI
MISO
SCK
4 to 16 bits
All information provided in this document is subject to legal disclaimers.
MSB
LSB
LSB
MSB
Rev. 2 — 7 July 2010
Q
4 to 16 bits
MSB
MSB
LSB
LSB
Q
4 to 16 bits
Chapter 13: LPC13xx SSP
UM10375
© NXP B.V. 2010. All rights reserved.
LSB
LSB
Q
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