LPC1343FHN33,551 NXP Semiconductors, LPC1343FHN33,551 Datasheet - Page 301

IC MCU 32BIT 32KB FLASH 33HVQFN

LPC1343FHN33,551

Manufacturer Part Number
LPC1343FHN33,551
Description
IC MCU 32BIT 32KB FLASH 33HVQFN
Manufacturer
NXP Semiconductors
Series
LPC13xxr
Datasheets

Specifications of LPC1343FHN33,551

Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC13
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, UART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
28
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, KSK-LPC1343
Development Tools By Supplier
OM11039, OM11040, OM11046, OM11048
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Package
33HVQFN EP
Device Core
ARM Cortex M3
Family Name
LPC1000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4944
935289655551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1343FHN33,551
Manufacturer:
NXP
Quantity:
780
NXP Semiconductors
UM10375
User manual
19.13.7 Copy RAM to flash <Flash address> <RAM address> <no of bytes>
Table 297. ISP Prepare sector(s) for write operation command
Table 298. ISP Copy command
Command
Input
Return Code
Description
Example
Command
Input
Return Code CMD_SUCCESS |
Description
Example
C
Flash Address(DST): Destination flash address where data bytes are to be
written. The destination address should be a 256 byte boundary.
RAM Address(SRC): Source RAM address from where data bytes are to be read.
Number of Bytes: Number of bytes to be written. Should be 256 | 512 | 1024 |
4096.
SRC_ADDR_ERROR (Address not on word boundary) |
DST_ADDR_ERROR (Address not on correct boundary) |
SRC_ADDR_NOT_MAPPED |
DST_ADDR_NOT_MAPPED |
COUNT_ERROR (Byte count is not 256 | 512 | 1024 | 4096) |
SECTOR_NOT_PREPARED_FOR WRITE_OPERATION |
BUSY |
CMD_LOCKED |
PARAM_ERROR |
CODE_READ_PROTECTION_ENABLED
This command is used to program the flash memory. The "Prepare Sector(s) for
Write Operation" command should precede this command. The affected sectors are
automatically protected again once the copy command is successfully executed.
The boot block cannot be written by this command. This command is blocked when
code read protection is enabled. Also see
can be written.
"C 0 268467504 512<CR><LF>" copies 512 bytes from the RAM address
0x1000 0800 to the flash address 0.
P
Start Sector Number
End Sector Number: Should be greater than or equal to start sector number.
CMD_SUCCESS |
BUSY |
INVALID_SECTOR |
PARAM_ERROR
This command must be executed before executing "Copy RAM to flash" or "Erase
Sector(s)" command. Successful execution of the "Copy RAM to flash" or "Erase
Sector(s)" command causes relevant sectors to be protected again. The boot
block can not be prepared by this command. To prepare a single sector use the
same "Start" and "End" sector numbers.
"P 0 0<CR><LF>" prepares the flash sector 0.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 July 2010
Chapter 19: LPC13xx Flash memory programming firmware
Section 19.6
for the number of bytes that
UM10375
© NXP B.V. 2010. All rights reserved.
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