LPC1343FHN33,551 NXP Semiconductors, LPC1343FHN33,551 Datasheet - Page 306

• Manufacturer Part Number: LPC1343FHN33,551
• Description: IC MCU 32BIT 32KB FLASH 33HVQFN
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1343FHN33,551

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 28
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 28
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSK-LPC1343
• Development Tools By Supplier: OM11039, OM11040, OM11046, OM11048
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Package: 33HVQFN EP
• Device Core: ARM Cortex M3
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4944; 935289655551

NXP Semiconductors
UM10375
User manual
unsigned long result[4];
or
unsigned long * command;
unsigned long * result;
command=(unsigned long *) 0x……
result= (unsigned long *) 0x……
Define pointer to function type, which takes two parameters and returns void. Note the IAP
returns the result with the base address of the table residing in R1.
typedef void (*IAP)(unsigned int [],unsigned int[]);
IAP iap_entry;
Setting function pointer:
iap_entry=(IAP) IAP_LOCATION;
Whenever you wish to call IAP you could use the following statement.
iap_entry (command, result);
As per the ARM specification (The ARM Thumb Procedure Call Standard SWS ESPC
0002 A-05) up to 4 parameters can be passed in the r0, r1, r2 and r3 registers
respectively. Additional parameters are passed on the stack. Up to 4 parameters can be
returned in the r0, r1, r2 and r3 registers respectively. Additional parameters are returned
indirectly via memory. Some of the IAP calls require more than 4 parameters. If the ARM
suggested scheme is used for the parameter passing/returning then it might create
problems due to difference in the C compiler implementation from different vendors. The
suggested parameter passing scheme reduces such risk.
The flash memory is not accessible during a write or erase operation. IAP commands,
which results in a flash write/erase operation, use 32 bytes of space in the top portion of
the on-chip RAM for execution. The user program should not be use this space if IAP flash
programming is permitted in the application.
Table 308. IAP Command Summary
IAP Command
Prepare sector(s) for write operation
Copy RAM to flash
Erase sector(s)
Blank check sector(s)
Read Part ID
Read Boot code version
Compare
Reinvoke ISP
Read UID
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 July 2010
Chapter 19: LPC13xx Flash memory programming firmware
Command Code
50
51
52
53
54
55
56
57
58
10
10
10
10
10
10
10
10
10
Described in
Table 309
Table 310
Table 311
Table 312
Table 313
Table 314
Table 315
Table 316
Table 317
UM10375
© NXP B.V. 2010. All rights reserved.
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