D12332VFC20V Renesas Electronics America, D12332VFC20V Datasheet - Page 215

• Manufacturer Part Number: D12332VFC20V
• Description: IC H8S/2332 MCU ROMLESS 144QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12332VFC20V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• For Use With: EDK2329 - DEV EVALUATION KIT H8S/2329
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

6.6
When burst mode is selected with the DRAM interface, the DACK output timing can be selected
with the DDS bit. When DRAM space is accessed in DMAC single address mode at the same
time, the DDS bit selects whether or not burst access is to be performed.
6.6.1
Burst access is performed by determining the address only, irrespective of the bus master. With
the DRAM interface, the DACK output goes low from the T
Figure 6.28 shows the DACK output timing for the DRAM interface when DDS = 1.
Note: n = 2 to 5
Read
Write
Figure 6.28 DACK Output Timing when DDS = 1 (Example of DRAM Access)
DMAC Single Address Mode and DRAM Interface
When DDS = 1
A
CS
CAS (UCAS)
LCAS (LCAS)
HWR (WE)
D
HWR (WE)
D
DACK
φ
23
15
15
n
to A
to D
to D
(RAS)
0
0
0
T
p
Row
T
r
Rev.4.00 Sep. 07, 2007 Page 183 of 1210
c1
state.
T
c1
Column
T
c2
REJ09B0245-0400