WG82574IT S LBAC Intel, WG82574IT S LBAC Datasheet - Page 448
WG82574IT S LBAC
Manufacturer Part Number
WG82574IT S LBAC
Description
CONTROLLER, ENET, INTEL 82574IT, 64PQFN
Manufacturer
Intel
Datasheet
1.WG82574IT_S_LBAC.pdf
(490 pages)
Specifications of WG82574IT S LBAC
Ethernet Type
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Supply Voltage Range
3V To 3.6V
Operating Temperature Range
-40°C To +85°C
Digital Ic Case Style
QFN
No. Of Pins
64
Package / Case
QFN
Interface Type
I2C, JTAG, PCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Figure 75.
13.5.5.3
448
Layout for Discrete Magnetics
Board Stack-Up Recommendations
Printed circuit boards for these designs typically have four, six, eight, or more layers.
Although, the 82574 does not dictate the stack up, here is an example of a typical six-
layer board stack up:
This board stack up configuration can be adjusted to conform to specific OEM design
rules.
• Layer 1 is a signal layer. It can contain the differential analog pairs from the
• Layer 2 is a signal ground layer. Chassis ground may also be fabricated in Layer 2
• Layer 3 is used for power planes.
• Layer 4 is a signal layer.
• Layer 5 is an additional ground layer.
• Layer 6 is a signal layer. For 1000 BASE-T (copper) Gigabit designs, it is common to
Ethernet device to the magnetics module.
under the connector side of the magnetics module.
route two of the differential pairs (per port) on this layer.
RJ-45
Magnetics Module
82574 GbE Controller—Design Considerations
82574L
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