WG82574IT S LBAC Intel, WG82574IT S LBAC Datasheet - Page 472

• Manufacturer Part Number: WG82574IT S LBAC
• Description: CONTROLLER, ENET, INTEL 82574IT, 64PQFN
• Manufacturer: Intel

Specifications of WG82574IT S LBAC

• Ethernet Type: IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Digital Ic Case Style: QFN
• No. Of Pins: 64
• Package / Case: QFN
• Interface Type: I2C, JTAG, PCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Note:
14.7
Table 95.
14.7.1
14.7.2
472
1. Tcase is defined as the maximum case temperature without any thermal enhancement to the package.

and 
heat actually flows in multiple directions, 
calculations with the 82574.
The thermal parameters listed in
assembled on a 4-layer 30 x 56 mm mini PCIe board connected to a system board in a
natural convection environment. The maximum case temperature is based on the
maximum junction temperature and defined by the relationship, Tcase-max = Tjmax -
(
parameter. 
Thermal Specifications
To ensure proper operation and reliability of the 82574, the thermal solution must
maintain a case temperature at or below the values specified in
or component-level thermal enhancements are required to dissipate the generated heat
if the case temperature exceeds the maximum temperatures listed in
Good system airflow is critical to dissipate the highest possible thermal power. The size
and number of fans, vents, and/or ducts, and, their placement in relation to
components and airflow channels within the system determine airflow. Acoustic noise
constraints might limit the size and types of fans, vents and ducts that can be used in a
particular design.
To develop a reliable, cost-effective thermal solution, all of the system variables must
be considered. Use system-level thermal characteristics and simulations to account for
individual component thermal requirements.
82574L Preliminary Thermal Absolute Maximum Rating
Case Temperature
The 82574L is designed to operate properly as long as the Tcase is not exceeded.
Section 14.12
Designing for Thermal Performance
Section 14.14
achieve the required 82574L thermal performance.
JC
JT
and 
x Power) where 
JB
each assume that all heat flows to either the case or board. However, since the
JB
Parameter
are not included as a part of the thermal parameters for the 82574. 
JA
Tcase
describes the proper guidelines for measuring case temperature.
describes the PCB and system design recommendations required to
is the package junction-to-air thermal resistance.
1
JT
is the junction-to-package top thermal characterization
Table 94
82574 GbE Controller—Thermal Design Considerations
are based on simulated results of packages
JT
is more applicable to making thermal
Maximum
109 °C
Table
95. System-level
Table
95.
JC