WG82574IT S LBAC Intel, WG82574IT S LBAC Datasheet - Page 465
WG82574IT S LBAC
Manufacturer Part Number
WG82574IT S LBAC
Description
CONTROLLER, ENET, INTEL 82574IT, 64PQFN
Manufacturer
Intel
Datasheet
1.WG82574IT_S_LBAC.pdf
(490 pages)
Specifications of WG82574IT S LBAC
Ethernet Type
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Supply Voltage Range
3V To 3.6V
Operating Temperature Range
-40°C To +85°C
Digital Ic Case Style
QFN
No. Of Pins
64
Package / Case
QFN
Interface Type
I2C, JTAG, PCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Design Considerations—82574 GbE Controller
13.10
Figure 89.
13.11
Assembly Process Flow
Figure 89
Assembly Flow
Reflow Guidelines
The typical reflow profile consists of four sections. In the preheat section, the PCB
assembly should be preheated at the rate of 1 to 2 °C/sec to start the solvent
evaporation and to avoid thermal shock. The assembly should then be thermally
soaked for 60 to 120 seconds to remove solder paste volatiles and for activation of flux.
The reflow section of the profile, the time above liquidus should be between 45 to 60
seconds with a peak temperature in the range of 245 to 250 °C, and the duration at the
peak should not exceed 30 seconds. Finally, the assembly should undergo cool down in
the fourth section of the profile. A typical profile band is provided in
220 °C is referred to as an approximation of the liquidus point. The actual profile
parameters depend upon the solder paste used and specific recommendations from the
solder paste manufacturers should be followed.
shows the typical process flow for mounting packages to the PCB.
Figure
90, in which
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