KC82870DH S L5X2 Intel, KC82870DH S L5X2 Datasheet - Page 57

• Manufacturer Part Number: KC82870DH S L5X2
• Manufacturer: Intel

Specifications of KC82870DH S L5X2

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Ballout and Package Information
6.1
Intel
®
Figure 6-1. 567-Ball (DMH) OLGA1 Package Dimensions – Top View
E8870DH DDR Memory Hub (DMH) Datasheet
Section 6.1
number.
567-Ball OLGA1 Package Information
The 567-ball OLGA1 package has an exposed die mounted on a package substrate. The package’s
coplanarity is controlled to a maximum of 8 mil. A heatsink, with appropriate interface material
and retention capabilities, is required for proper operation.
Handling Exclusion Area
Table 6-2
described the package used by DMH.
0.546 in.
list the ballout numbers in alphabetical pin order.
0.346 in.
0.100 in.
0.100 in.
0.100 in.
0.366 in.
17.00 mm
21.00 mm
38.27 mm
0.666 in.
DMH
Die
Table 6-1
0.200 in.
list the pins in alphabetical ballout
17.00 mm
21.00 mm 31.00 mm
Die Keepout Area
001234
6
6-1