TXC-04222-AIOG Transwitch Corporation, TXC-04222-AIOG Datasheet - Page 239

• Manufacturer Part Number: TXC-04222-AIOG
• Manufacturer: Transwitch Corporation

Specifications of TXC-04222-AIOG

• Screening Level: Industrial
• Package Type: BGA
• Lead Free Status / Rohs Status: Not Compliant

PACKAGE INFORMATION
The TEMx28 device is packaged in a 376-lead plastic ball grid array (PBGA) package suitable for surface
mounting, as illustrated in Figure 42.
(A3)
Notes:
1. All dimensions are in millimeters. Values shown
2. Identification of the solder ball A1 corner is con-
3. Size of array: 22 x 22, JEDEC code MO-151.
D D2
are for reference only.
tained within this shaded zone. Package corner
may not be a 90 angle.
A2
Proprietary TranSwitch Corporation Information for use Solely by its Customers
Figure 42. TEMx28 TXC-04222 376-Lead Plastic Ball Grid Array Package
E1/4
TRANSWITCH
TXC-04222AIOG
D1/4
E2
Note 2
E
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DATA SHEET
Dimension (Note 1)
A
-D1-
D1 (Nom)
E1 (Nom)
A3 (Ref.)
e (Ref.)
A1
A2
D2
E2
D
A1
A
b
E
AB
AA Y W V
U
Bottom View
T
R P N M
19.45
19.45
Min
2.02
0.40
1.12
0.50
-E1-
L
K J H G F E D C B
23.00
21.00
23.00
21.00
0.56
1.00
TXC-04222-MB, Ed. 6
20.20
20.20
TXC-04222
Max
2.44
0.60
1.22
0.70
A
TEMx28
22
21
20
19
18
17
16
15
14
13
12
11
10
June 2003
9
8
7
6
5
4
3
2
1
b
e