UPD78F0500AMC-CAB-AX Renesas Electronics America, UPD78F0500AMC-CAB-AX Datasheet - Page 916

• Manufacturer Part Number: UPD78F0500AMC-CAB-AX
• Description: MCU 8BIT 30SSOP
• Manufacturer: Renesas Electronics America
• Series: 78K0/Kx2r

Specifications of UPD78F0500AMC-CAB-AX

• Core Processor: 78K/0
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, I²C, LIN, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

78K0/Kx2
Note
Cautions
R01UH0008EJ0401 Rev.4.01
Jul 15, 2010
Infrared reflow
Wave soldering
Partial heating
Soldering Method
(3) 30-pin plastic SSOP (7.62 mm (300))
Table 35-2. Soldering Conditions of Expanded-specification products (
38-pin plastic SSOP (7.62 mm (300))
44-pin plastic LQFP (10x10)
52-pin plastic LQFP (10x10)
64-pin plastic LQFP (14x14)
64-pin plastic LQFP (12x12)
80-pin plastic LQFP (14x14)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
PD78F050xAMC-CAB-AX (x = 0 to 3), 78F0503DAMC-CAB-AX
PD78F050xAMCA-CAB-G (x = 0 to 3), 78F050xAMCA2-CAB-G (x = 0 to 3)
PD78F051xAMC-GAA-AX (x = 1 to 3), 78F0513DAMC-GAA-AX
PD78F051xAMCA-GAA-G (x = 1 to 3), 78F051xAMCA2-GAA-G (x = 1 to 3)
PD78F051xAGB-GAF-AX (x = 1 to 3), 78F0513DAGB-GAF-AX
PD78F05x1AGBA-GAF-G (x = 1 to 3), 78F051xAGBA2-GAF-G (x = 1 to 3)
PD78F052xAGB-GAG-AX (x = 1 to 7), 78F0527DAGB-GAG-AX
PD78F052xAGBA-GAG-G (x = 1 to 7), 78F052xAGBA2-GAG-G (x = 1 to 7)
PD78F053xAGC-GAL-AX (x = 1 to 7), 78F0537DAGC-GAL-AX
PD78F053xAGCA-GAL-G (x = 1 to 7), 78F053xAGCA2-GAL-G (x = 1 to 7)
PD78F053xAGK-GAJ-AX (x = 1 to 7), 78F0537DAGK-GAJ-AX
PD78F053xAGKA-GAJ-G (x = 1 to 7), 78F053xAGKA2-GAJ-G (x = 1 to 7)
PD78F054xAGC-GAD-G (x = 4 to 7), 78F0547DAGC-GAD-AX
PD78F054xAGCA-GAD-G (x = 4 to 7), 78F054xAGCA2-GAD-G (x = 4 to 7)
1. Do not use different soldering methods together (except for partial heating).
2. The
evaluation. Do not use the on-chip debug function in products designated for mass production,
because the guaranteed number of rewritable times of the flash memory may be exceeded when
this function is used, and product reliability therefore cannot be guaranteed. Renesas Electronics is
not liable for problems occurring when the on-chip debug function is used.
μ
PD78F05xxDA has an on-chip debug function, which is provided for development and
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature),
Exposure limit: 7 days
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 32 ELECTRICAL SPECIFICATIONS (A2) GRADE PRODUCTS
Note
(after that, prebake at 125°C for 10 to 72 hours)
Soldering Conditions
Note
(after that, prebake at 125°C for
μ
PD78F05xxA and 78F05xxDA) (2/2)
IR60-107-3
WS60-107-1
Condition Symbol
Recommended
−
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