LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 100

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Figure 7-7.
98
temperature specification is found in
fan heatsink is able to keep the processor temperature within the specifications (see
Table
fan heatsink to operate properly, it is critical that the airflow provided to the fan
heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the
sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow
through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink
reduces the cooling efficiency and decreases fan life.
illustrate an acceptable airspace clearance for the fan heatsink. The air temperature
entering the fan should be kept below 38 ºC. Again, meeting the processor's
temperature specification is the responsibility of the system integrator.
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)
5-1) in chassis that provide good thermal management. For the boxed processor
Chapter 5
of this document. The boxed processor
Figure 7-7
Boxed Processor Specifications
and
Figure 7-8
Datasheet