LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 80

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Table 5-1.
78
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 5-1
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
requirements, systems should be designed to the Flexible Motherboard (FMB)
guidelines, even if a processor with a lower thermal dissipation is currently planned. In
all cases the Thermal Monitor or Thermal Monitor 2 feature must be enabled
for the processor to remain within specification.
Processor Thermal Specifications
Notes:
1.
2.
3.
4.
Processor
Number
E3110
E3120
L3110
Specification is at 36°C Tc and minimum voltage loadline. Specification is guaranteed by design
characterization and not 100% tested.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not
the maximum power that the processor can dissipate.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower
TDP. Therefore, the maximum T
thermal profile figure and associated table for the allowed combinations of power and T
FMB, or Flexible Motherboard, guidelines provide a design target for meeting future thermal requirements.
instead of the maximum processor power consumption. The Thermal Monitor
Frequency
(GHz)
Core
3.00
3.16
3.00
Thermal
Design
Power
(W)
65.0
65.0
45.0
2,3
C
will vary depending on the TDP of the individual processor. Refer to
Extended
Section
Power
HALT
(W)
8
8
6
1
5.2. To ensure maximum flexibility for future
Thermal Specifications and Design Considerations
775_VR_CONFIG_06A
775_VR_CONFIG_06
FMB Guidance
(65 W)
(45 W)
4
Minimu
m T
(°C)
5
C
Maximum T
See
C
Figure 5-1
.
Table 5-2
(°C)
and
Datasheet
C
Notes