LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 17

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Electrical Specifications
2.5
2.6
2.6.1
Table 2-2.
Datasheet
Flexible Motherboard Guidelines (FMB)
The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the
processor will have over certain time periods. The values are only estimates and actual
specifications for future processors may differ. Processors may or may not have
specifications equal to the FMB value in the foreseeable future. System designers
should meet the FMB values to ensure their systems will be compatible with future
processors. The FMB values are shown in
Power Segment Identifier (PSID)
Power Segment Identifier (PSID) is a mechanism to prevent booting under mismatched
power requirement situations. The PSID mechanism enables BIOS to detect if the
processor in use requires more power than the platform voltage regulator (VR) is
capable of supplying. For example, a 130W TDP processor installed in a board with a
65W or 95W TDP capable VR may draw too much power and cause a potential VR issue.
Absolute Maximum and Minimum Ratings
Table 2-2
functional limits of the processor. Within functional operation limits, functionality and
long-term reliability can be expected.
At conditions outside functional operation condition limits, but within absolute
maximum and minimum ratings, neither functionality nor long-term reliability can be
expected. If a device is returned to conditions within functional operation limits after
having been subjected to conditions outside these limits, but within the absolute
maximum and minimum ratings, the device may be functional, but with its lifetime
degraded depending on exposure to conditions exceeding the functional operation
condition limits.
At conditions exceeding absolute maximum and minimum ratings, neither functionality
nor long-term reliability can be expected. Moreover, if a device is subjected to these
conditions for any length of time then, when returned to conditions within the
functional operating condition limits, it will either not function, or its reliability will be
severely degraded.
Although the processor contains protective circuitry to resist damage from static
electric discharge, precautions should always be taken to avoid high static voltages or
electric fields.
Absolute Maximum and Minimum Ratings
Notes:
1.
2.
3.
V
V
T
T
CASE
STORAGE
CC
TT
Symbol
For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must
be satisfied.
Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor.
Storage temperature is applicable to storage conditions only. In this scenario, the processor must not
receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect
specifies absolute maximum and minimum ratings only and lie outside the
Core voltage with respect to V
FSB termination voltage with
respect to V
Processor case temperature
Processor storage temperature
Parameter
SS
SS
Table 2-3
See
Section 5
Min
–0.3
–0.3
–40
and
Table
See
Section 5
Max
1.45
1.45
5-1.
85
Unit
°C
°C
V
V
-
-
-
3, 4, 5
Notes
1, 2
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