LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 95

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Boxed Processor Specifications
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7.1
Note:
Note:
Figure 7-1.
Datasheet
Boxed Processor Specifications
Introduction
The processor will also be offered as an Intel boxed processor. Intel boxed processors
are intended for system integrators who build systems from baseboards and standard
components. The boxed processor will be supplied with a cooling solution. This chapter
documents baseboard and system requirements for the cooling solution that will be
supplied with the boxed processor. This chapter is particularly important for OEMs that
manufacture baseboards for system integrators.
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets].
processor.
Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the Wolfdale Processors Thermal and Mechanical Design
Guidelines Addendum for further guidance. Contact your local Intel Sales
Representative for this document.
Mechanical Representation of the Boxed Processor
Note:
The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Figure 7-1
shows a mechanical representation of a boxed
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