LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 31

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Package Mechanical Specifications
3
3.1
Figure 3-1.
3.1.1
Datasheet
System Board
System Board
Substrate
Substrate
Package Mechanical
Specifications
Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA8) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
of the processor package components and how they are assembled together. Refer to
the LGA775 Socket Mechanical Design Guide for complete details on the LGA775
socket.
The package components shown in
Processor Package Assembly Sketch
Note:
1.
Package Mechanical Drawing
The package mechanical drawings are shown in
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
Socket and motherboard are included for reference and are not part of processor package.
IHS
IHS
Core (die)
Core (die)
Figure 3-1
TIM
TIM
include the following:
Figure 3-2
Capacitors
Capacitors
and
Figure 3-1
Figure
LGA775 Socket
LGA775 Socket
3-3. The
shows a sketch
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