LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 3

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Contents
1
2
3
4
5
Datasheet
Introduction
1.1
1.2
Electrical Specifications
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Package Mechanical Specifications
3.1
Land Listing and Signal Descriptions
4.1
4.2
Thermal Specifications and Design Considerations
5.1
5.2
Terminology ....................................................................................................... 9
1.1.1
References ....................................................................................................... 11
Power and Ground Lands.................................................................................... 13
Decoupling Guidelines ........................................................................................ 13
2.2.1
2.2.2
2.2.3
Voltage Identification ......................................................................................... 14
Reserved, Unused, and TESTHI Signals ................................................................ 16
Flexible Motherboard Guidelines (FMB) ................................................................. 17
Power Segment Identifier (PSID)......................................................................... 17
2.6.1
2.6.2
2.6.3
2.6.4
Signaling Specifications...................................................................................... 21
2.7.1
2.7.2
2.7.3
Clock Specifications ........................................................................................... 26
2.8.1
2.8.2
2.8.3
2.8.4
Package Mechanical Specifications ....................................................................... 31
3.1.1
3.1.2
3.1.3
3.1.4
3.1.5
3.1.6
3.1.7
3.1.8
3.1.9
Processor Land Assignments ............................................................................... 39
Alphabetical Signals Reference ............................................................................ 70
Processor Thermal Specifications ......................................................................... 77
5.1.1
5.1.2
Processor Thermal Features ................................................................................ 81
5.2.1
5.2.2
Processor Terminology Definitions ............................................................ 10
Vcc Decoupling ...................................................................................... 13
Vtt Decoupling ....................................................................................... 13
FSB Decoupling...................................................................................... 14
Absolute Maximum and Minimum Ratings .................................................. 17
DC Voltage and Current Specification ........................................................ 18
VCC Overshoot ...................................................................................... 20
Die Voltage Validation ............................................................................. 21
FSB Signal Groups.................................................................................. 22
CMOS and Open Drain Signals ................................................................. 23
Processor DC Specifications ..................................................................... 23
2.7.3.1
2.7.3.2
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 26
FSB Frequency Select Signals (BSEL[2:0])................................................. 27
Phase Lock Loop (PLL) and Filter .............................................................. 27
BCLK[1:0] Specifications ......................................................................... 28
Package Mechanical Drawing.................................................................... 31
Processor Component Keep-Out Zones ...................................................... 35
Package Loading Specifications ................................................................ 36
Package Handling Guidelines.................................................................... 36
Package Insertion Specifications............................................................... 36
Processor Mass Specification .................................................................... 37
Processor Materials................................................................................. 37
Processor Markings................................................................................. 37
Processor Land Coordinates ..................................................................... 37
Thermal Specifications ............................................................................ 77
Thermal Metrology ................................................................................. 81
Thermal Monitor..................................................................................... 81
Thermal Monitor 2 .................................................................................. 82
....................................................................................................... 9
GTL+ Front Side Bus Specifications ............................................. 25
Platform Environment Control Interface (PECI) DC Specifications..... 24
............................................................................... 13
.................................................................. 31
............................................................... 39
....................................... 77
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