LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 4

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

6
7
8
Figures
4
2-1 Processor V
2-2 V
2-3 Differential Clock Waveform .......................................................................................29
2-4 Measurement Points for Differential Clock Waveforms....................................................29
3-1 Processor Package Assembly Sketch ...........................................................................31
3-2 Processor Package Drawing Sheet 1 of 3......................................................................33
3-3 Processor Package Drawing Sheet 2 of 3......................................................................34
3-4 Processor Package Drawing Sheet 3 of 3......................................................................35
3-5 Processor Top-Side Markings Example .........................................................................37
3-6 Processor Land Coordinates and Quadrants, Top View ...................................................38
4-1 land-out Diagram (Top View – Left Side) .....................................................................40
4-2 land-out Diagram (Top View – Right Side) ...................................................................41
5.3
Features
6.1
6.2
Boxed Processor Specifications
7.1
7.2
7.3
7.4
Debug Tools Specifications
8.1
CC
Overshoot Example Waveform..............................................................................21
5.2.3
5.2.4
5.2.5
Platform Environment Control Interface (PECI) ......................................................84
5.3.1
5.3.2
Power-On Configuration Options ..........................................................................87
Clock Control and Low Power States .....................................................................87
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
Introduction ......................................................................................................93
Mechanical Specifications ....................................................................................94
7.2.1
7.2.2
7.2.3
Electrical Requirements ......................................................................................96
7.3.1
Thermal Specifications........................................................................................97
7.4.1
7.4.2
Logic Analyzer Interface (LAI) ........................................................................... 103
8.1.1
8.1.2
..............................................................................................................87
CC
On-Demand Mode ...................................................................................83
PROCHOT# Signal ..................................................................................84
THERMTRIP# Signal ................................................................................84
Introduction ...........................................................................................84
5.3.1.1
PECI Specifications .................................................................................85
5.3.2.1
5.3.2.2
5.3.2.3
5.3.2.4
Normal State .........................................................................................88
HALT and Extended HALT Powerdown States ..............................................88
6.2.2.1
6.2.2.2
Stop Grant and Extended Stop Grant States ...............................................89
6.2.3.1
6.2.3.2
Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop
State, and Stop Grant Snoop State90
6.2.4.1
6.2.4.2
Enhanced Intel SpeedStep
Processor Power Status Indicator (PSI) Signal ............................................91
Boxed Processor Cooling Solution Dimensions.............................................94
Boxed Processor Fan Heatsink Weight .......................................................95
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....96
Fan Heatsink Power Supply ......................................................................96
Boxed Processor Cooling Requirements......................................................97
Variable Speed Fan .................................................................................99
Mechanical Considerations ..................................................................... 103
Electrical Considerations ........................................................................ 103
Static and Transient Tolerance ...............................................................20
TCONTROL and TCC activation on PECI-Based Systems ..................85
PECI Device Address..................................................................85
PECI Command Support .............................................................85
PECI Fault Handling Requirements ...............................................86
PECI GetTemp0() Error Code Support ..........................................86
HALT Powerdown State ..............................................................88
Extended HALT Powerdown State ................................................89
Stop-Grant State.......................................................................89
Extended Stop Grant State .........................................................90
HALT Snoop State, Stop Grant Snoop State ..................................90
Extended HALT Snoop State, Extended Stop Grant Snoop State.......90
.............................................................................. 103
........................................................................93
®
Technology ....................................................90
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