LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 96

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

7.2
7.2.1
Figure 7-2.
94
Mechanical Specifications
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed processor. The
boxed processor will be shipped with an unattached fan heatsink.
mechanical representation of the boxed processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in
View). The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in
(marked with alphabetic designations) to clarify relative dimensioning.
Side View Space Requirements for the Boxed Processor
Figure 7-7
81.3
[3.2]
and
Figure
7-8. Note that some figures have centerlines shown
[3.74]
95.0
Figure 7-2
(Side View), and
[0.39]
Boxed Processor Specifications
10.0
Figure 7-1
Figure 7-3
Boxed_Proc_SideView
[0.98]
25.0
shows a
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