LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 37

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Package Mechanical Specifications
3.1.6
3.1.7
Table 3-3.
3.1.8
Figure 3-5.
3.1.9
Datasheet
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
Processor Materials
Table 3-3
Processor Materials
Processor Markings
Figure 3-5
identification of the processor.
Processor Top-Side Markings Example
Processor Land Coordinates
Figure 3-6
referred to throughout the document to identify processor lands.
Integrated Heat Spreader (IHS)
Substrate Lands
lists some of the package components and associated materials.
Component
shows the topside markings on the processor. This diagram is to aid in the
shows the top view of the processor land coordinates. The coordinates are
Substrate
INTEL
INTEL® XEON®
SLxxx [COO]
3.00GHZ/6M/1333/06
[FPO]
Fiber Reinforced Resin
M
e
Nickel Plated Copper
4
Gold Plated Copper
©'06 3110
Material
S/N
ATPO
37