LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 36

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

3.1.3
.
Table 3-1.
3.1.4
Table 3-2.
3.1.5
36
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See
out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
Package Loading Specifications
Table 3-1
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solutions.
Processor Loading Specifications
Notes:
1.
2.
3.
4.
Package Handling Guidelines
Table 3-2
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Package Handling Guidelines
Notes:
1.
2.
3.
4.
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the
minimum specified load on the processor package.
These specifications are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
These guidelines are based on limited testing for design characterization.
Parameter
Dynamic
Static
provides dynamic and static load specifications for the processor package.
includes a list of guidelines on package handling in terms of recommended
Parameter
Tensile
Torque
Shear
80 N [17 lbf]
Minimum
-
Maximum Recommended
3.95 N-m [35 lbf-in]
311 N [70 lbf]
111 N [25 lbf]
756 N [170 lbf]
311 N [70 lbf]
Maximum
Figure 3-2
Package Mechanical Specifications
and
Figure 3-3
Notes
1, 4
2, 4
3, 4
1, 2, 3
1, 3, 4
Notes
for keep-
Datasheet