LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 79

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Thermal Specifications and Design Considerations
5
5.1
5.1.1
Datasheet
Thermal Specifications and
Design Considerations
Processor Thermal Specifications
The processor requires a thermal solution to maintain temperatures within the
operating limits as set forth in
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete thermal solution includes both component and system level thermal
management features. Component level thermal solutions can include active or passive
heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system
level thermal solutions may consist of system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the
appropiate Thermal and Mechanical Design Guidelines (see
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum case temperature (T
specifications when operating at or below the Thermal Design Power (TDP) value listed
per frequency in
thermal capability may affect the long-term reliability of the processor and system.
The processor uses a methodology for managing processor temperatures which is
intended to support acoustic noise reduction through fan speed control. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) bus as described in
Section
temperature is permitted to exceed the Thermal Profile. If the value reported via PECI
is greater than or equal to T
at or below the temperature as specified by the thermal profile. The temperature
reported over PECI is always a negative value and represents a delta below the onset of
thermal control circuit (TCC) activation, as indicated by PROCHOT# (see
Systems that implement fan speed control must be designed to take these conditions in
to account. Systems that do not alter the fan speed only need to ensure the case
temperature meets the thermal profile specifications.
In order to determine a processor's case temperature specification based on the
thermal profile, it is necessary to accurately measure processor power dissipation. Intel
has developed a methodology for accurate power measurement that correlates to Intel
test temperature and voltage conditions. Refer to the Wolfdale Processors Thermal and
Mechanical Design Guidelines Addendum and the Live Die System Thermal Testing
Basics for the details of this methodology.
5.3. If the value reported via PECI is less than T
Table
5-1. Thermal solutions not designed to provide this level of
CONTROL
Section
, then the processor case temperature must remain
5.1.1. Any attempt to operate the processor
CONTROL
Section
, then the case
1.2).
Section
C
)
5.2).
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