LPC2470FBD208,551 NXP Semiconductors, LPC2470FBD208,551 Datasheet - Page 541
![IC ARM7 MCU LCD 208-LQFP](/photos/12/13/121391/208-lqfp_sot459-1_pkg_sml.jpg)
LPC2470FBD208,551
Manufacturer Part Number
LPC2470FBD208,551
Description
IC ARM7 MCU LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FBD208,551
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4361-5
935284068551
LPC2470FBD208-S
935284068551
LPC2470FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2470FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
UM10237_4
User manual
Fig 99. SPI frame format with CPOL = 1 and CPHA = 0 (a) Single and b) Continuous Transfer)
a. Single transfer with CPOL=1 and CPHA=0
b. Continuous transfer with CPOL=1 and CPHA=0
SSEL
MOSI
MISO
SCK
MSB
MSB
In this configuration, during idle periods:
If the SSP is enabled and there is valid data within the transmit FIFO, the start of
transmission is signified by the SSEL master signal being driven LOW, which causes
slave data to be immediately transferred onto the MISO line of the master. Master’s MOSI
pin is enabled.
One half period later, valid master data is transferred to the MOSI line. Now that both the
master and slave data have been set, the SCK master clock pin becomes LOW after one
further half SCK period. This means that data is captured on the falling edges and be
propagated on the rising edges of the SCK signal.
In the case of a single word transmission, after all bits of the data word are transferred, the
SSEL line is returned to its idle HIGH state one SCK period after the last bit has been
captured.
However, in the case of continuous back-to-back transmissions, the SSEL signal must be
pulsed HIGH between each data word transfer. This is because the slave select pin
freezes the data in its serial peripheral register and does not allow it to be altered if the
CPHA bit is logic zero. Therefore the master device must raise the SSEL pin of the slave
device between each data transfer to enable the serial peripheral data write. On
completion of the continuous transfer, the SSEL pin is returned to its idle state one SCK
period after the last bit has been captured.
•
•
•
The CLK signal is forced HIGH.
SSEL is forced HIGH.
The transmit MOSI/MISO pad is in high impedance.
SSEL
MOSI
MISO
SCK
4 to 16 bits
MSB
Rev. 04 — 26 August 2009
LSB
LSB
MSB
Q
4 to 16 bits
Chapter 20: LPC24XX SSP interface SSP0/1
MSB
MSB
LSB
LSB
Q
4 to 16 bits
UM10237
© NXP B.V. 2009. All rights reserved.
LSB
LSB
Q
541 of 792
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