LPC2470FBD208,551 NXP Semiconductors, LPC2470FBD208,551 Datasheet - Page 676
![IC ARM7 MCU LCD 208-LQFP](/photos/12/13/121391/208-lqfp_sot459-1_pkg_sml.jpg)
LPC2470FBD208,551
Manufacturer Part Number
LPC2470FBD208,551
Description
IC ARM7 MCU LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FBD208,551
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4361-5
935284068551
LPC2470FBD208-S
935284068551
LPC2470FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2470FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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1. How to read this chapter
2. Flash boot loader
3. Features
4. Applications
5. Description
UM10237_4
User manual
Remark: This chapter applies to parts LPC2458, LPC2468, and LPC2478.
The Boot Loader controls initial operation after reset, and also provides the means to
accomplish programming of the Flash memory. This could be initial programming of a
blank device, erasure and re-programming of a previously programmed device, or
programming of the Flash memory by the application program in a running system.
The Flash boot loader provides both In-System and In-Application programming
interfaces for programming the on-chip Flash memory.
The Flash boot loader code is executed every time the part is powered on or reset. The
loader can execute the ISP command handler or the user application code. A LOW level
after reset at the P2.10 pin is considered as an external hardware request to start the ISP
command handler. Assuming that power supply pins are on their nominal levels when the
rising edge on RESET pin is generated, it may take up to 3 ms before P2.10 is sampled
and the decision on whether to continue with user code or ISP handler is made. If P2.10 is
sampled low and the watchdog overflow flag is set, the external hardware request to start
the ISP command handler is ignored. If there is no request for the ISP command handler
execution (P2.10 is sampled HIGH after reset), a search is made for a valid user program.
If a valid user program is found then the execution control is transferred to it. If a valid user
program is not found, the auto-baud routine is invoked.
Pin P2.10 that is used as hardware request for ISP requires special attention. Since P2.10
is in high impedance mode after reset, it is important that the user provides external
hardware (a pull-up resistor or other device) to put the pin in a defined state. Otherwise
unintended entry into ISP mode may occur.
•
•
UM10237
Chapter 30: LPC24XX Flash memory programming firmware
Rev. 04 — 26 August 2009
In-System Programming: In-System programming (ISP) is programming or
reprogramming the on-chip Flash memory, using the boot loader software and UART0
serial port. This can be done when the part resides in the end-user board.
In Application Programming: In-Application (IAP) programming is performing erase
and write operation on the on-chip Flash memory, as directed by the end-user
application code.
Rev. 04 — 26 August 2009
© NXP B.V. 2009. All rights reserved.
User manual
676 of 792
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