LPC2470FBD208,551 NXP Semiconductors, LPC2470FBD208,551 Datasheet - Page 559
![IC ARM7 MCU LCD 208-LQFP](/photos/12/13/121391/208-lqfp_sot459-1_pkg_sml.jpg)
LPC2470FBD208,551
Manufacturer Part Number
LPC2470FBD208,551
Description
IC ARM7 MCU LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FBD208,551
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4361-5
935284068551
LPC2470FBD208-S
935284068551
LPC2470FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2470FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
- Current page: 559 of 792
- Download datasheet (5Mb)
NXP Semiconductors
UM10237_4
User manual
5.3.8 Data counter
Note: The DPSM remains in the WAIT_S state for at least two clock periods to meet Nwr
timing constraints.
If a FIFO underrun error occurs, the DPSM sets the FIFO error flag and moves to the
IDLE state.
If a timeout occurs while the DPSM is in the BUSY state, it sets the data timeout flag and
moves to the IDLE state.
The data timer is enabled when the DPSM is in the WAIT_R or BUSY state, and
generates the data timeout error:
The data counter has two functions:
•
•
•
•
•
•
SEND: The DPSM starts sending data to a card. Depending on the transfer mode bit
in the data control register, the data transfer mode can be either block or stream:
– In block mode, when the data block counter reaches zero, the DPSM sends an
– In stream mode, the DPSM sends data to a card while the enable bit is HIGH and
BUSY: The DPSM waits for the CRC status flag:
– If it does not receive a positive CRC status, it moves to the IDLE state and sets the
– If it receives a positive CRC status, it moves to the WAIT_S state if MCIDAT0 is not
When transmitting data, the timeout occurs if the DPSM stays in the BUSY state for
longer than the programmed timeout period
When receiving data, the timeout occurs if the end of the data is not true, and if the
DPSM stays in the WAIT_R state for longer than the programmed timeout period.
To stop a data transfer when it reaches zero. This is the end of the data condition.
To start transferring a pending command (see
the stop command for a stream data transfer.
internally generated CRC code and end bit, and moves to the BUSY state.
the data counter is not zero. It then moves to the IDLE state.
CRC fail status flag.
LOW (the card is not busy).
Rev. 04 — 26 August 2009
Chapter 21: LPC24XX SD/MMC card interface
Figure
21–110). This is used to send
UM10237
© NXP B.V. 2009. All rights reserved.
559 of 792
Related parts for LPC2470FBD208,551
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![LPC2470](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC2420_60](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC2458](/photos/41/52/415299/sot570-3_3d_tmb.gif)
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC2468](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC2478](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
![XA-G30](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
![XA-G37](/photos/41/52/415289/sot187-2_3d_tmb.gif)
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
![XA-S3](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
![LH75401_LH75411_N](/photos/41/52/415297/sot486-1_3d_tmb.gif)
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC3130_3131](/photos/41/52/415299/sot570-3_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC3141FET180](/photos/41/52/415299/sot570-3_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
![LPC3143FET180](/photos/41/52/415299/sot570-3_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
![LPC3152FET208](/photos/41/53/415307/sot930-1_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
![LPC3154FET208](/photos/41/53/415307/sot930-1_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
![BUK714R1-40BT](/photos/41/53/415317/sot426_3d_tmb.gif)
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: