R5F61668RN50FPV Renesas Electronics America, R5F61668RN50FPV Datasheet - Page 33

• Manufacturer Part Number: R5F61668RN50FPV
• Description: IC H8SX/1668 MCU FLASH 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of R5F61668RN50FPV

• Core Processor: H8SX
• Core Size: 16/32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 92
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• For Use With: R0K561668S000BE - KIT STARTER FOR H8SX/1668R0K561664S001BE - KIT STARTER FOR H8SX/1651HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

28.10 Sleep Instruction Exception Handling ............................................................................ 1281
28.11 φ Clock Output Control................................................................................................... 1284
28.12 Usage Notes .................................................................................................................... 1285
Section 29 List of Registers .............................................................................1287
29.1
29.2
29.3
Section 30 Electrical Characteristics ...............................................................1359
30.1
30.2
30.3
30.4
30.5
30.6
30.7
30.8
30.9
Appendix............................................................................................................1421
A.
B.
C.
D.
28.9.4
28.12.1 I/O Port Status................................................................................................. 1285
28.12.2 Current Consumption during Oscillation Settling Standby Period ................. 1285
28.12.3 Module Stop State of EXDMAC, DMAC, or DTC ........................................ 1285
28.12.4 On-Chip Peripheral Module Interrupts ........................................................... 1285
28.12.5 Writing to MSTPCRA, MSTPCRB, and MSTPCRC ..................................... 1285
28.12.6 Control of Input Buffers by DIRQnE (n = 3 to 0)........................................... 1286
28.12.7 Conflict between a transition to deep standby mode and interrupts................ 1286
28.12.8 Bφ/SDRAMφ Output State ............................................................................. 1286
Register Addresses (Address Order)............................................................................... 1288
Register Bits.................................................................................................................... 1307
Register States in Each Operating Mode ........................................................................ 1339
Absolute Maximum Ratings ........................................................................................... 1359
DC Characteristics H8SX/1668R Group ...................................................................... 1360
DC Characteristics H8SX/1668M Group...................................................................... 1363
AC Characteristics .......................................................................................................... 1367
30.4.1
30.4.2
30.4.3
30.4.4
30.4.5
USB Characteristics ........................................................................................................ 1413
A/D Conversion Characteristics ..................................................................................... 1415
D/A Conversion Characteristics ..................................................................................... 1415
Flash Memory Characteristics ........................................................................................ 1416
Power-On Reset Circuit and Voltage-Detection Circuit Characteristics
(H8SX/1668M Group) .................................................................................................... 1418
Port States in Each Pin State........................................................................................... 1421
Product Lineup................................................................................................................ 1427
Package Dimensions ....................................................................................................... 1428
Treatment of Unused Pins............................................................................................... 1430
Timing Sequence at Power-On ....................................................................... 1280
Clock Timing .................................................................................................. 1367
Control Signal Timing .................................................................................... 1370
Bus Timing ..................................................................................................... 1371
DMAC and EXDMAC Timing....................................................................... 1402
Timing of On-Chip Peripheral Modules ......................................................... 1406
Rev. 2.00 Sep. 24, 2008 Page xxxi of xxxii