ATSAM3U4CA-CU Atmel, ATSAM3U4CA-CU Datasheet - Page 390

• Manufacturer Part Number: ATSAM3U4CA-CU
• Description: IC MCU 32BIT 256KB FLSH 100TFBGA
• Manufacturer: Atmel
• Series: SAM3Ur

Specifications of ATSAM3U4CA-CU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 52K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 4x10b, 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFBGA
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 52 KB
• Interface Type: 3xUSART, TWI, 4xSPI, Bus
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 57
• Number Of Timers: 8
• Operating Supply Voltage: 1.62 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3U-EK
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 25-34. Read Enable Timing Configuration Working with NAND Flash Device
Figure 25-35. Ready/Busy Timing Configuration
390
390
mck
cle
mck
wen
cen
ale
ren
ren
rbn
SAM3U Series
SAM3U Series
Use TWB field in SMC_TIMINGS register to configure the maximum elapsed time between the
rising edge of wen signal and the falling edge of rbn signal. Use TRR field in the SMC_TIMINGS
register to program the number of clock cycle between the rising edge of the rbn signal and the
falling edge of ren signal.
• Ready/Busy Signal Timing configuration working with a NAND Flash device
t
WB
t
AR
busy
t
CLR
t
REN_SETUP
t
REN_CYCLE
t
t
REN_PULSE
RR
t
REH
6430D–ATARM–25-Mar-11
6430D–ATARM–25-Mar-11