MPC8379EVRAJF Freescale Semiconductor, MPC8379EVRAJF Datasheet - Page 113

• Manufacturer Part Number: MPC8379EVRAJF
• Description: MPU PWRQUICC II 533MHZ 689TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8379EVRAJF

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 533MHz
• Voltage: 1V
• Mounting Type: Surface Mount
• Package / Case: 689-TePBGA II
• Maximum Clock Frequency: 533 MHz
• Operating Supply Voltage: 1.8 V to 2.5 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 533MHz
• Embedded Interface Type: DUART, HSSI, I2C, IPIC, JTAG, SPI, USB
• Digital Ic Case Style: BGA
• No. Of Pins: 689
• Rohs Compliant: Yes
• For Use With: MPC8377E-RDBA - BOARD REF DES MPC8377 REV 2.1MPC8377E-MDS-PB - BOARD MODULAR DEV SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

24 Thermal
This section describes the thermal specifications of the MPC8377E.
24.1
Table 81
Freescale Semiconductor
Note:
1
2
3
4
5
6
Junction-to-ambient natural convection on single layer board (1s)
Junction-to-ambient natural convection on four layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single layer board (1s)
Junction-to-ambient (at 200 ft/min) on four layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Ref
25.0
33.3
50.0
50.0
66.7
66.7
66.7
Values in MHz.
System PLL VCO range: 400–800 MHz.
CSB frequencies less than 133 MHz will not support Gigabit Ethernet rates.
Minimum data rate for DDR2 is 250 MHz and for DDR1 is 167 MHz.
Applies to DDR2 only.
Applies to eLBC PLL-enabled mode only.
1
LBCM DDRCM SVCOD SPMF
0
0
0
0
0
0
0
provides the package thermal characteristics for the 689 31 × 31mm TePBGA II package.
Thermal Characteristics
0
0
0
0
0
0
0
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Table 80. Example Clock Frequency Combinations (continued)
4
2
4
2
2
2
2
Table 81. Package Thermal Characteristics for TePBGA II
Parameter
8
8
4
8
4
5
6
VCO
Sys
800
533
800
800
533
667
800
1,
2
CSB
266.7
266.7
200
200
400
333
400
1
,3
DDR data
rate
400
400
200
267
200
267
333
1,
5
5
4
100
133
100
133
—
—
—
/2
6
6
6
6
eLBC
Symbol
R
R
83.3
100
100
R
R
R
R
66.7
66.7
θJMA
θJMA
50
50
/4
θJB
θJC
θJA
θJA
6
6
6
1
33.3
33.3
41.6
25
25
50
50
/8
Value
21
15
16
12
8
6
333
400
× 1
—
—
—
—
—
× 1.5
400
600
400
500
600
—
—
e300 Core
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
400
533
400
800
533
667
800
× 2
× 2.5
500
667
500
667
1
—
—
—
Notes
1, 2, 3
Thermal
1, 2
1, 3
1, 3
4
5
600
800
600
800
× 3
—
—
—
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