MPC8379EVRAJF Freescale Semiconductor, MPC8379EVRAJF Datasheet - Page 89
MPC8379EVRAJF
Manufacturer Part Number
MPC8379EVRAJF
Description
MPU PWRQUICC II 533MHZ 689TEPBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheets
1.MPC8377EVRAGD.pdf
(126 pages)
2.MPC8377EVRAGD.pdf
(2 pages)
3.MPC8379VRAGD.pdf
(116 pages)
Specifications of MPC8379EVRAJF
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
533MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
689-TePBGA II
Maximum Clock Frequency
533 MHz
Operating Supply Voltage
1.8 V to 2.5 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
533MHz
Embedded Interface Type
DUART, HSSI, I2C, IPIC, JTAG, SPI, USB
Digital Ic Case Style
BGA
No. Of Pins
689
Rohs Compliant
Yes
For Use With
MPC8377E-RDBA - BOARD REF DES MPC8377 REV 2.1MPC8377E-MDS-PB - BOARD MODULAR DEV SYSTEM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8379EVRAJF
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MPC8379EVRAJF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Figure 63
Note:
1
2
3
4
5
Freescale Semiconductor
All dimensions are in millimeters.
Dimensioning and tolerancing per ASME Y14. 5M-1994.
Maximum solder ball diameter measured parallel to Datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Parallelism measurement should exclude any effect of mark on top surface of package.
Figure 63. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II
shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package.
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Package and Pin Listings
89