MPC8379EVRAJF Freescale Semiconductor, MPC8379EVRAJF Datasheet - Page 87

MPU PWRQUICC II 533MHZ 689TEPBGA

MPC8379EVRAJF

Manufacturer Part Number
MPC8379EVRAJF
Description
MPU PWRQUICC II 533MHZ 689TEPBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheets

Specifications of MPC8379EVRAJF

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
533MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
689-TePBGA II
Maximum Clock Frequency
533 MHz
Operating Supply Voltage
1.8 V to 2.5 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
533MHz
Embedded Interface Type
DUART, HSSI, I2C, IPIC, JTAG, SPI, USB
Digital Ic Case Style
BGA
No. Of Pins
689
Rohs Compliant
Yes
For Use With
MPC8377E-RDBA - BOARD REF DES MPC8377 REV 2.1MPC8377E-MDS-PB - BOARD MODULAR DEV SYSTEM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8379EVRAJF
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
MPC8379EVRAJF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
occurs in the 1–15 MHz range. The source impedance of the clock driver should be 50 Ω to match the
transmission line and reduce reflections which are a source of noise to the system.
Table 71
Freescale Semiconductor
At recommended operating conditions with XV
Rising Edge Rate
Falling Edge Rate
Differential Input High Voltage
Differential Input Low Voltage
Rising edge rate (SDn_REF_CLK) to falling edge rate
(SDn_REF_CLK) matching
Note:
1
2
3
4
Measurement taken from single ended waveform.
Measurement taken from differential waveform.
Measured from –200 mV to +200 mV on the differential waveform (derived from SDn_REF_CLK minus SDn_REF_CLK). The
signal must be monotonic through the measurement region for rise and fall time. The 400 mV measurement window is
centered on the differential zero crossing. See
Matching applies to rising edge rate for SDn_REF_CLK and falling edge rate for SDn_REF_CLK. It is measured using a
200 mV window centered on the median cross point where SDn_REF_CLK rising meets SDn_REF_CLK falling. The median
cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. The Rise Edge
Rate of SDn_REF_CLK should be compared to the Fall Edge Rate of SDn_REF_CLK, the maximum allowed difference
should not exceed 20% of the slowest edge rate. See
SDn_REF_CLK
SDn_REF_CLK
VIH = +200 mV
VIL = –200 mV
describes some AC parameters common to PCI Express and SATA protocols.
Minus
SDn_REF_CLK
SDn_REF_CLK
V
0.0 V
CROSS MEDIAN
Figure 61. Single-Ended Measurement Points for Rise and Fall Time Matching
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Parameter
Figure 60. Differential Measurement Points for Rise and Fall Time
Rise Edge Rate
Table 71. SerDes Reference Clock Common AC Parameters
DD_SRDS
or XV
Figure
DD_SRDS
60.
Figure
V
V
Rise-Fall Matching
CROSS MEDIAN
CROSS MEDIAN
= 1.0 V ± 5%.
Rise Edge Rate
Fall Edge Rate
61.
Symbol
V
V
SDn_REF_CLK
SDn_REF_CLK
V
IH
IL
CROSS MEDIAN
+100 mV
–100 mV
Fall Edge Rate
Min
200
1.0
1.0
T
FALL
High-Speed Serial Interfaces (HSSI)
–200
Max
4.0
4.0
20
T
RISE
Unit
V/ns
V/ns
mV
mV
%
Notes
2, 3
2, 3
1, 4
2
2
87

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