MC68360CAI25L Freescale Semiconductor, MC68360CAI25L Datasheet - Page 399

IC MPU QUICC 25MHZ 240-FQFP

MC68360CAI25L

Manufacturer Part Number
MC68360CAI25L
Description
IC MPU QUICC 25MHZ 240-FQFP
Manufacturer
Freescale Semiconductor

Specifications of MC68360CAI25L

Processor Type
M683xx 32-Bit
Speed
25MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
240-FQFP
Family Name
M68000
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
25MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
5V
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (min)
4.75V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
240
Package Type
FQFP
Controller Family/series
68K
Core Size
32 Bit
Cpu Speed
25MHz
No. Of Timers
4
Embedded Interface Type
SCP, TDM
Digital Ic Case Style
FQFP
Supply Voltage Range
3V To 3.6V, 4.75V To 5.25V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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7.8.4.6 SI RAM PROGRAMMING EXAMPLE. This example shows how to program the
RAM to support the 10-bit IDL bus (see Figure 7-33 for the 10-bit IDL bus format).
In this example, the TSA supports the B1 channel with SCC2, the D channel with SCC1, the
first 4 bits of the B2 channel with an external device (using a strobe to enable the external
device), and the last 4 bits of B2 with SCC4. Additionally, the TSA will mark the D channel
with another strobe signal.
First, divide the frame from the start (i.e., the sync) to the end of the frame according to the
support that is required:
Each of these six divisions can be supported by just one SI RAM entry. Thus, a total of only
six entries is needed in the SI RAM:
7.8.4.7 SI RAM DYNAMIC CHANGES. The SI RAM, described in 7.8.4.5 Programming SI
RAM Entries, has four operating modes:
1. 8 bits (B1)—SCC2
2. 1 bit (D)—SCC1 + strobe1
3. 1 bit—no support
4. 4 bits (B2)—strobe2
5. 4 bits (B2)—SCC4
6. 1 bit (D)—SCC1 + strobe1
1. One TDM with a static routing definition. SI RAM divided into two parts (Rx and Tx).
2. One TDM allowing dynamic changes. SI RAM divided into four parts.
3. Two TDMs with static routing definition. SI RAM divided into four parts.
4. Two TDMs allowing dynamic changes. SI RAM divided into eight parts.
Since IDL requires the same routing for both receive and trans-
mit, an exact duplicate of the above entries should be written to
both the receive and transmit sections of the SI RAM. Then the
CRTx bit in the SIMODE register can be used to instruct the SI
RAM to use the same clock and sync to simultaneously control
both sets of SI RAM entries.
Entry
No.
1
2
3
4
5
6
SWTR
0
0
0
0
0
0
Freescale Semiconductor, Inc.
For More Information On This Product,
SSEL
0000
0001
0000
0010
0000
0001
MC68360 USER’S MANUAL
Go to: www.freescale.com
CSEL
010
001
000
000
100
001
0000
0000
0000
0011
0011
0000
CNT
NOTE
RAM WORD
BYT
1
0
0
0
0
0
Serial Interface with Time Slot Assigner
LST
0
0
0
0
0
1
1 Bit SCC1 Strobe1
1 Bit SCC1 Strobe1
1 Bit No Support
4 Bits Strobe2
description
8 Bits SCC2
4 Bits SCC4

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