AMD-K6-2E/400AFR AMD [Advanced Micro Devices], AMD-K6-2E/400AFR Datasheet - Page 312

• Manufacturer Part Number: AMD-K6-2E/400AFR
• Manufacturer: AMD [Advanced Micro Devices]

AMD-K6™-2E Processor Data Sheet
Soldered Installation:
Maximum Ambient
Temperature
.
Table 72. Soldered CPGA Package: Measured Maximum Ambient Temperature
Figure 108. Measured Maximum Ambient Temperature (Soldered, 321-Pin CPGA Package)
294
Heatsink Type
No Heatsink
A (15 mm)
B (20 mm)
C (30 mm)
80
70
60
50
40
30
20
10
0
Table 72 and Figure 108 show the measured maximum ambient
temperature (T
the system for the low-power embedded AMD-K6-2E processors
with a maximum thermal power dissipation of 10.0 watts (for
OPNs: AMD-K6-2E/266AMZ, AMD-K6-2E/300AMZ, and
AMD-K6-2E/333AMZ) and a maximum case temperature rating
of 85
when soldered into a printed circuit board.
0
°
C, in the 321-pin Ceramic Pin Grid Array package (CPGA)
1
Preliminary Information
0.0 m/s
Airflow Rate (m/s)
14
33
36
T
42
C
°C
°C
°C
°C
Thermal Design
= 85°C, P
A
) values in
2
d
1.0 m/s
= 10 W
Maximum T
31
51
56
60
°C
°C
°C
°C
°
3
C at different levels of airflow in
A
2.0 m/s
(°C) v. Airflow (m/s)
42
61
65
69
°C
°C
°C
°C
4
(°C)
3.0 m/s
53
70
71
66
°C
°C
°C
°C
22529B/0—January 2000
Chapter 16
4.0 m/s
58
72
73
68
°C
°C
°C
°C