MMC2114 MOTOROLA [Motorola, Inc], MMC2114 Datasheet - Page 614

• Manufacturer Part Number: MMC2114
• Description: M CORE Microcontrollers
• Manufacturer: MOTOROLA [Motorola, Inc]

Preliminary Electrical Specifications
23.4 Thermal Characteristics
23.5 Junction Temperature Determination
Advance Information
614
The average chip-junction temperature (T
where:
For most applications, P
P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring P
T
J
D
can be obtained by solving equations (1) and (2) iteratively for any value of T
T
P
P
P
and T
JA
A
D
INT
I/O
= Ambient temperature, C
= Package thermal resistance, junction-to-ambient, C/W
= P
= I
= Power dissipation on input and output pins — user determined
J
(if P
DD
INT
I/O
D
V
(at equilibrium) for a known T
is neglected) is:
P
DD
I/O
, watts — chip internal power
Thermal Resistance
I/O
K = P
Plastic 100-pin LQFP surface mount
Plastic 144-pin LQFP surface mount
Plastic 196-ball MAPBGA
Freescale Semiconductor, Inc.
For More Information On This Product,
P
D
INT
P
Ã
à Ã
Preliminary Electrical Specifications
D
T
and can be neglected. An approximate relationship between
(T
J
= K
Go to: www.freescale.com
= T
A
+ 273 C) +
A
Table 23-2. Thermal Characteristics
Parameter
(T
+ P
J
) in C can be obtained from:
J
+ 273 C)
D
Ã
x
A
Ã
. Using this value of K, the values of P
JA
JA
Ã
à Ã
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
P
D
Ã!
Ã
Symbol
JA
Value
A
44
46
60
.
MOTOROLA
D
Unit
(1)
(2)
(3)
and
C/W