MMC2114 MOTOROLA [Motorola, Inc], MMC2114 Datasheet - Page 640

• Manufacturer Part Number: MMC2114
• Description: M CORE Microcontrollers
• Manufacturer: MOTOROLA [Motorola, Inc]

Mechanical Specifications
24.3 Bond Pins
Advance Information
640
This section shows the latest package specifications available at the
time of this publication. To make sure that you have the latest
information, contact one of the following:
Follow the World Wide Web on-line instructions to retrieve the current
mechanical specifications.
The die has a total of 144 bond pads. Of these, the pads that are not
bonded out in the 100-pin package are distributed around the
circumference of the die. This optional group of pins includes:
For more detailed information, see
•
•
Freescale Semiconductor, Inc.
For More Information On This Product,
Local Motorola Sales Office
World Wide Web at
A[22:0]
R/W
EB[3:0]
CSE[1:0]
TC[2:0]
OE
CS[3:0]
3 x V
3 x V
DD
SS
Go to: www.freescale.com
Mechanical Specifications
http://www.motorola.com/semiconductors/
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
Section 3. Signal
Description.
MOTOROLA