AT91SAM9G45-CU-999 Atmel, AT91SAM9G45-CU-999 Datasheet - Page 1161
AT91SAM9G45-CU-999
Manufacturer Part Number
AT91SAM9G45-CU-999
Description
IC MCU ARM9 APMC 324TFBGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheet
1.AT91SAM9G45-EKES.pdf
(1218 pages)
Specifications of AT91SAM9G45-CU-999
Core Processor
ARM9
Core Size
16/32-Bit
Speed
400MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB
Peripherals
AC'97, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Size
64KB (64K x 8)
Program Memory Type
ROM
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 1.1 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
324-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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46.4
46.4.1
Table 46-5.
46.4.2
Table 46-6.
46.5
Table 46-7.
Note:
6438F–ATARM–21-Jun-10
Symbol
1/(t
Symbol
1/(t
Symbol
1/(t
C
C
C
t
I
P
I
ST
DDST
DD ON
ON
CRYSTAL
INT
LEXT
CPPCK
CPMCK
CPMAIN
(1)
Clock Characteristics
Main Oscillator Characteristics
1. The C
(1)
)
)
)
Processor Clock Characteristics
Master Clock Characteristics
asitic capacitance, package and board, must be calculated in order to reach 15 pF (minimum targeted load for the
oscillator) by taking into account the internal load C
tance must be: 15 pF - 4 pF = 11 pF which means that 22 pF is the target value (22 pF from xin to gnd and 22 pF from xout
to gnd) If 20 pF load is targeted, the sum of pad, package, board and external capacitances must be 20 pF - 4 pF = 16 pF
which means 32 pF (32 pF from xin to gnd and 32 pF from xout to gnd).
Parameter
Crystal Oscillator Frequency
Crystal Load Capacitance
Internal Load Capacitance
External Load Capacitance
Duty Cycle
Startup Time
Standby Current Consumption
Drive Level
Current Dissipation
Processor Clock Waveform Parameters
Master Clock Waveform Parameters
Main Oscillator Characteristics
CRYSTAL
Parameter
Processor Clock Frequency
Parameter
Master Clock Frequency
value is specified by the crystal manufacturer. In our case, C
The master clock is the maximum clock at which the system is able to run. It is given by the
smallest value of the internal bus clock and EBI clock.
Note:
1. For DDR2 usage, there are no limitations to LDDDR, SDRAM and mobile SDRAM.
Conditions
C
C
Standby mode
@ 8 MHz
@ 16 MHz
CRYSTAL
CRYSTAL
Conditions
VDDCORE = 0.9V
T = 85°C
Conditions
VDDCORE = 0.9V
T = 85°C
= 15 pF
= 20 pF
INT
(1)
(1)
. So, to target the minimum oscillator load of 15 pF, external capaci-
CRYSTAL
0.35
Min
125
125
0.7
15
40
Min
Min
8
(1)
(1)
must be between 15 pf and 20 pF. All par-
Typ
AT91SAM9G45
12
22
32
50
4
Max
Max
400
133
Max
0.55
150
1.1
16
20
60
2
1
Units
Units
MHz
MHz
MHz
Unit
μW
mA
mA
ms
pF
pF
pF
μA
Pf
%
1161
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