AT91SAM9G45-CU-999 Atmel, AT91SAM9G45-CU-999 Datasheet - Page 1192
AT91SAM9G45-CU-999
Manufacturer Part Number
AT91SAM9G45-CU-999
Description
IC MCU ARM9 APMC 324TFBGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheet
1.AT91SAM9G45-EKES.pdf
(1218 pages)
Specifications of AT91SAM9G45-CU-999
Core Processor
ARM9
Core Size
16/32-Bit
Speed
400MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB
Peripherals
AC'97, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Size
64KB (64K x 8)
Program Memory Type
ROM
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 1.1 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
324-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Table 47-1.
Table 47-2.
Table 47-3.
Table 47-4.
47.2
1192
Ball Land
Soldering Mask Opening
400
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Soldering Profile
AT91SAM9G45
Soldering Information
Device and 324-ball TFBGA Package Maximum Weight
324-ball TFBGA Package Characteristics
Package Reference
This package respects the recommendations of the NEMI User Group.
Table 47-5
Table 47-5.
Note:
A maximum of three reflow passes is allowed per component.
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5 C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25 C to Peak Temperature
It is recommended to apply a soldering temperature higher than 250°C
gives the recommended soldering profile from J-STD-020C.
Soldering Profile
mg
0.4 mm +/- 0.05
0.275 mm +/- 0.03
3
MO-210
e1
Green Package
3 C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260 +0 C
6 C/sec. max.
8 min. max.
6438F–ATARM–21-Jun-10
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