LPC1759FBD80,551 NXP Semiconductors, LPC1759FBD80,551 Datasheet - Page 416

• Manufacturer Part Number: LPC1759FBD80,551
• Description: IC ARM CORTEX MCU 512K 80-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1759FBD80,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 80-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 52
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 6x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC17
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: Ethernet, USB, OTG, CAN
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 52
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 6 Channel
• On-chip Dac: 10 bit
• Package: 80LQFP
• Device Core: ARM Cortex M3
• Family Name: LPC17xx
• Maximum Speed: 120 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4968; 935290523551

NXP Semiconductors
UM10360
User manual
18.5.2.3 SPI format with CPOL=0,CPHA=1
18.5.2.4 SPI format with CPOL = 1,CPHA = 0
In the case of a single word transmission, after all bits of the data word have been
transferred, the SSEL line is returned to its idle HIGH state one SCK period after the last
bit has been captured.
However, in the case of continuous back-to-back transmissions, the SSEL signal must be
pulsed HIGH between each data word transfer. This is because the slave select pin
freezes the data in its serial peripheral register and does not allow it to be altered if the
CPHA bit is logic zero. Therefore the master device must raise the SSEL pin of the slave
device between each data transfer to enable the serial peripheral data write. On
completion of the continuous transfer, the SSEL pin is returned to its idle state one SCK
period after the last bit has been captured.
The transfer signal sequence for SPI format with CPOL = 0, CPHA = 1 is shown in
Figure
In this configuration, during idle periods:
If the SSP is enabled and there is valid data within the transmit FIFO, the start of
transmission is signified by the SSEL master signal being driven LOW. Master’s MOSI pin
is enabled. After a further one half SCK period, both master and slave valid data is
enabled onto their respective transmission lines. At the same time, the SCK is enabled
with a rising edge transition.
Data is then captured on the falling edges and propagated on the rising edges of the SCK
signal.
In the case of a single word transfer, after all bits have been transferred, the SSEL line is
returned to its idle HIGH state one SCK period after the last bit has been captured.
For continuous back-to-back transfers, the SSEL pin is held LOW between successive
data words and termination is the same as that of the single word transfer.
Single and continuous transmission signal sequences for SPI format with CPOL=1,
CPHA=0 are shown in
Fig 78. SPI frame format with CPOL=0 and CPHA=1
•
•
•
The CLK signal is forced LOW.
SSEL is forced HIGH.
The transmit MOSI/MISO pad is in high impedance.
78, which covers both single and continuous transfers.
All information provided in this document is subject to legal disclaimers.
SSEL
MOSI
MISO
SCK
Rev. 2 — 19 August 2010
Figure
Q
79.
MSB
MSB
4 to 16 bits
LSB
LSB
Chapter 18: LPC17xx SSP0/1
Q
UM10360
© NXP B.V. 2010. All rights reserved.
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