MCIMX281AVM4B Freescale Semiconductor, MCIMX281AVM4B Datasheet - Page 27

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MCIMX281AVM4B

Manufacturer Part Number
MCIMX281AVM4B
Description
IC MPU I.MX28 1.2 289MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX28r
Datasheets

Specifications of MCIMX281AVM4B

Core Processor
ARM9
Core Size
32-Bit
Speed
454MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Program Memory Size
128KB (32K x 32)
Program Memory Type
Mask ROM
Ram Size
32K x 32
Voltage - Supply (vcc/vdd)
1.25 V ~ 5.25 V
Data Converters
A/D 17x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
289-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Supplier Unconfirmed
Section Number
Freescale Semiconductor, Inc.
12.7
12.8
12.9
12.10
12.11
12.12
High Assurance Boot (HAB)........................................................................................................................................968
Constructing Boot Image (SB Files) to Be Loaded by ROM.......................................................................................969
I2C Boot Mode.............................................................................................................................................................972
SPI Boot Mode..............................................................................................................................................................972
SD/MMC Boot Mode...................................................................................................................................................975
NAND Boot Mode........................................................................................................................................................979
12.7.1
12.8.1
12.10.1
12.10.2
12.10.3
12.11.1
12.11.2
12.11.3
12.11.4
12.11.5
12.12.1
ROM Vector Table Addresses....................................................................................................................969
ROM Commands.......................................................................................................................................970
SSP Pin Configuration...............................................................................................................................973
Media Format............................................................................................................................................973
SSP............................................................................................................................................................974
Boot Control Block (BCB) Data Structure................................................................................................977
Master Boot Record (MBR) Media Format..............................................................................................978
eMMC Fast Boot Media Format...............................................................................................................978
eSD Fast Boot Media Format....................................................................................................................979
Device Identification.................................................................................................................................979
Raw NAND Device Boot..........................................................................................................................979
12.12.1.1
12.12.1.2
12.12.1.3
12.12.1.4
12.12.1.5
12.12.1.6
12.12.1.7
12.12.1.8
12.12.1.9
12.12.1.10
12.12.1.11
i.MX28 Applications Processor Reference Manual, Rev. 1, 2010
Search Area.............................................................................................................................980
Search Count...........................................................................................................................980
Search Stride...........................................................................................................................980
Boot Control Blocks (BCB)....................................................................................................980
Redundant Boot Support in ROM NAND driver....................................................................982
NAND Patch Boot using FCB................................................................................................983
Expected NAND Layout.........................................................................................................983
Firmware Configuration Block...............................................................................................985
Single Error Correct and Double Error Detect (SEC-DED) Hamming..................................986
Firmware Layout on the NAND..............................................................................................986
Recovery From a Failed Boot Firmware Image Read.............................................................986
Title
Page
27

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