EP2AGX190FF35C6N Altera, EP2AGX190FF35C6N Datasheet - Page 213

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EP2AGX190FF35C6N

Manufacturer Part Number
EP2AGX190FF35C6N
Description
IC ARRIA II GX 190K 1152FBGA
Manufacturer
Altera
Series
Arria II GXr

Specifications of EP2AGX190FF35C6N

Number Of Logic Elements/cells
181165
Number Of Labs/clbs
7612
Total Ram Bits
9939
Number Of I /o
612
Voltage - Supply
0.87 V ~ 0.93 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-FBGA
Family Name
Arria® II GX
Number Of Logic Blocks/elements
190300
# I/os (max)
612
Frequency (max)
400MHz
Operating Supply Voltage (typ)
900mV
Logic Cells
190300
Ram Bits
10380902.4
Operating Supply Voltage (min)
0.87V
Operating Supply Voltage (max)
0.93V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
1152
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant

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Chapter 7: External Memory Interfaces in Arria II Devices
Memory Interfaces Pin Support for Arria II Devices
Figure 7–14. Number of DQ/DQS Groups per Bank in EP2AGZ225 Devices in the 1517-Pin FineLine BGA Package
Notes to
(1) These numbers are preliminary until the devices are available.
(2) EP2AGZ225 devices do not support ×32/×36 mode. To interface with a ×36 QDR II+/QDR II SRAM device, refer to
(3) You can also use DQS/DQSn pins in some of the ×4 groups as R
(4) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
(5) You can also use some of the DQ/DQS pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQ/DQS group with any of its pin members
December 2010 Altera Corporation
(2), (3), (4),
Groups for ×36 QDR II+/QDR II SRAM Interface” on page
of the ×4 group are used as R
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
used for configuration purposes. Ensure that the DQ/DQS groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQ/DQS groups, depending on your configuration scheme.
Figure
48 User I/Os
42 User I/Os
48 User I/Os
42 User I/Os
I/O Bank 2C
I/O Bank 1A
I/O Bank 1C
I/O Bank 2A
×16/×18=1
×16/×18=1
×16/×18=1
×16/×18=1
7–14:
(5)
×8/×9=3
×8/×9=3
×8/×9=3
×8/×9=3
DLL1
DLL0
×4=7
×4=7
×4=6
×4=6
Figure 7–14
EP2AGZ225 devices in the 1517-pin FineLine BGA package.
40 User I/Os
40 User I/Os
I/O Bank 3A
I/O Bank 8A
×16/×18=1
×16/×18=1
×8/×9=3
×8/×9=3
UP
×4=6
×4=6
and R
DN
shows the number of DQ/DQS groups per bank in Arria II GZ
pins for OCT calibration. If two pins of a ×4 group are used as R
24 User I/Os
24 User I/Os
I/O Bank 8B
I/O Bank 3B
×16/×18=1
×16/×18=1
×8/×9=2
×8/×9=2
×4=4
×4=4
in the 1517-Pin FineLine BGA
32 User I/Os
32 User I/Os
I/O Bank 8C
I/O Bank 3C
×16/×18=0
×16/×18=0
7–21.
×8/×9=1
×8/×9=1
EP2AGZ225 Devices
×4=3
×4=3
UP
and R
32 User I/Os
32 User I/Os
I/O Bank 7C
I/O Bank 4C
×16/×18=0
DN
×16/×18=0
×8/×9=1
×8/×9=1
pins, but you cannot use a ×4 group for memory interfaces if two pins
×4=3
Arria II Device Handbook Volume 1: Device Interfaces and Integration
×4=3
24 User I/Os
24 User I/Os
I/O Bank 7B
I/O Bank 4B
×16/×18=1
×16/×18=1
×8/×9=2
×8/×9=2
×4=4
×4=4
40 User I/Os
40 User I/Os
I/O Bank 4A
×16/×18=1
I/O Bank 7A
×16/×18=1
×8/×9=3
×8/×9=3
UP
×4=6
×4=6
and R
DN
“Combining ×16/×18 DQ/DQS
pins for OCT calibration, you
42 User I/Os
48 User I/Os
42 User I/Os
48 User I/Os
I/O Bank 5C
I/O Bank 6A
I/O Bank 6C
I/O Bank 5A
×16/×18=1
×16/×18=1
×6/×18=1
×6/×18=1
×8/×9=3
×8/×9=3
×8/×9=3
×8/×9=3
DLL3
DLL2
×4=6
×4=7
×4=7
×4=6
(Note
7–17
1),

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