PM7311 pmc-sierra, PM7311 Datasheet - Page 294

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PM7311

Manufacturer Part Number
PM7311
Description
Freedm 84a1024l Assp Telecom Standard Datasheet
Manufacturer
pmc-sierra
Datasheet

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Document No.: PMC-2021832, Issue 2
20.2 Outside Plant Environment
This product is designed to operate over a wide temperature range when used with a heat sink and
is suited for outside plant equipment
Table 73 Outside Plant Thermal Information
Maximum long-term operating junction temperature (T
term life.
Maximum junction temperature (T
continued functional performance
local ambient temperature reaches 85 °C.
Minimum ambient temperature (T
Table 74 Device Compact Model
Junction-to-Case Thermal Resistance, q
Junction-to-Board Thermal Resistance, q
Table 75 Heat Sink Requirements
q
Power depends upon the operating mode. To obtain power information, refer to ‘High’ power
values in section 17.1 Power Requirements.
Notes
1.
2.
3.
4.
SA
+ q
The minimum ambient temperature requirement for Outside Plant Equipment meets the minimum
ambient temperature requirement for Industrial Equipment
Short-term is used as defined in Telcordia Technologies Generic Requirements GR-63-Core Core; for
more information about this standard, see [4]
q
junction-to-board thermal resistance, is obtained by simulating conditions described in JEDEC Standard
JESD 51-8; for more information about this standard, see [3]
q
attached material. The maximum q
system with all components in place
CS
JC
SA
, the junction-to-case thermal resistance, is a measured nominal value plus two sigma. q
4
is the thermal resistance of the heat sink to ambient. q
The sum of q
where:
T
location
P
q
SA
A
D
is the ambient temperature at the heat sink
is the operating power dissipated in the package
and q
[(105 - T
CS
are required for long-term operation
SA
+ q
A
) / P
CS
A
2
J
. This condition will typically be reached when the
must be less than or equal to:
)
) for short-term excursions with guaranteed
D
] - q
FREEDM 84A1024L ASSP Telecom Standard Product Data Sheet
3
SA
1
JC
JC
JB
.
required for the airspeed at the location of the device in the
] °C/W
0.25°C/W
4.5 °C/W
J
) to ensure adequate long-
CS
is the thermal resistance of the heat sink
Ambient
Heat Sink
Case
Junction
Board
q
q
q
q
CS
SA
JC
JB
105°C
125°C
-40°C
JB
Released
Compact
, the
Device
Model
294

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