HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 384

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 12 Bus State Controller (BSC)
12.3.4
The memory bus width in this LSI can be set for each area. In area 0, external pins can be used to
select byte (8 bits), word (16 bits), or longword (32 bits) on power-on reset. The memory bus
width of the other area is set by the register. The correspondence between the memory type,
external pins (MD3, MD4), and bus width is listed in the table below.
Table 12.4 Correspondence between External Pins (MD3 and MD4), Memory Type of CS0,
Note:
12.3.5
This LSI supports the big endian and little endian methods of data alignment. The data alignment
is specified using the external pin (MD5) at power-on reset as shown in table 12.5.
Table 12.5 Correspondence between External Pin (MD5) and Endians
Rev. 1.00 Dec. 27, 2005 Page 340 of 932
REJ09B0269-0100
MD4
0
1
MD5
0
1
*
Area 0 Memory Type and Memory Bus Width
Data Alignment
The bus width must not be specified as eight bits if the burst ROM (clock synchronous)
interface is selected.
and Memory Bus Width
MD3
0
1
0
1
Endian
Big endian
Little endian
Normal memory
Memory Type
Bus Width
Reserved (Setting prohibited)
8 bits*
16 bits
32 bits

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