HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 929

• Manufacturer Part Number: HD6417712BPV
• Description: MPU 1.5/3.3V 0K PB-FREE 256-BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH Ethernetr

Specifications of HD6417712BPV

• Core Processor: SH-3 DSP
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO
• Peripherals: DMA, POR, WDT
• Number Of I /o: 24
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

A12/A11 *
D31 to D0
A25 to A0
DACKn *
RD/WR
DQMxx
CKIO
RAS
CAS
CKE
CSn
Figure 24.32 Synchronous DRAM Burst Read Bus Cycle (Single Read × 4)
BS
1
2
Notes: 1. Address pin to be connected to A10 of SDRAM.
Different Row Address, CAS Latency = 2, TRCD = 1 Cycle)
t
t
t
t
t
t
t
RWD1
AD1
AD1
CSD1
RASD1
2. DACKn is a waveform when active-low is specified.
DQMD1
DACD
(Bank Active Mode, PRE + ACTV + READ Commands,
Tp
t
t
t
Row address
AD1
RWD1
RASD1
Tpw
t
RASD1
Tr
t
t
t
t
t
RASD1
AD1
AD1
CASD1
BSD
Tc1
t
AD1
Tc2
address
Column
t
AD1
(High)
Td1
Tc3
t
Read command
RDS2
t
t
AD1
Rev. 1.00 Dec. 27, 2005 Page 885 of 932
RDH2
(1-4)
Td2
Tc4
Section 24 Electrical Characteristics
t
t
BSD
CASD1
Td3
Td4
t
RDS2
t
REJ09B0269-0100
t
t
t
CSD1
DACD
DQMD1
RDH2
Tde
t
t
t
t
t
t
t
t
t
AD1
BSD
AD1
CSD1
RWD1
RASD1
CASD1
DACD
DQMD1